Standard Features |
Capability |
Layer Count |
0~20L |
Min. Line Width/Space |
3/3mil |
Min. Drill Size |
Mechanical drill size 8mil, Laser drill size 3mil |
Max. Copper Thickness |
Inner layers 4 OZ, Outer layers 6 OZ |
Layer To Layer Registration Tolerance |
±0.05mm |
Max. Finished Board Thickness |
5.0mm |
Min. Finished Board Thickness |
0.5mm |
Min. Core Dielectric Thickness |
0.075mm |
Max. Aspect Ratio |
8 : 1 ; HDI -10:1 |
Min. Impedance Tolerance |
±8%; Standard: ±10% |
Max. Production Panel Size |
520*750mm(PTH) |
520*1500(NPTH) |
|
Via In PAD |
YES |
Min. Soldermask Dam |
Light:4mil Matte: 6mil |
Surface finish |
HAL/Leadfree, OSP(Entek), Immersion Gold, Hard Gold Plating, Gold Finger up to 50u”, Carbon Ink, Peelable mask, Immersion Tin, Immersion Silver |