Standard Features

Capability

Layer Count

0~20L

Min. Line Width/Space

3/3mil

Min. Drill Size

Mechanical drill size 8mil, Laser drill size 3mil

Max. Copper Thickness

Inner layers 4 OZ, Outer layers 6 OZ

Layer To Layer Registration Tolerance

±0.05mm

Max. Finished Board Thickness

5.0mm

Min. Finished Board Thickness

0.5mm

Min. Core Dielectric Thickness

0.075mm

Max.  Aspect Ratio

8 : 1 ;  HDI -10:1

Min. Impedance Tolerance

±8%; Standard: ±10%

Max. Production Panel Size

520*750mm(PTH)

520*1500(NPTH)

Via In PAD

YES

Min. Soldermask Dam

Light:4mil Matte: 6mil

Surface finish

HAL/Leadfree, OSP(Entek), Immersion Gold, Hard Gold Plating, Gold Finger up to 50u”, Carbon Ink, Peelable mask, Immersion Tin, Immersion Silver